Packaging Expert for Integrated Photonics (m/w/x)

Packaging Expert for Integrated Photonics (m/w/x)

Oberkochen

Full time

2024-12-18

Posted Yesterday

JR_1038339

We are looking for an experienced and talented Packaging Expert to join our integrated photonics team. As a Package Designer (m/w/d), you will play a key role in the design and development of advanced photonic packaging solutions that enable the high performance and reliability of our photonic integrated circuits (PICs). You will work with multi-disciplinary teams to create innovative packaging designs that meet the technical requirements of advanced photonic systems. This is an exciting opportunity to be part of a fast-growing technology area, where you will contribute to the commercialisation and scaling of next-generation photonic technologies.

Your role:

Package Design & Development:

• Design and develop photonic packaging solutions for photonic integrated circuits (PICs), including mechanical, thermal, and optical interfaces.
• Optimize package designs for performance, reliability, and manufacturability, considering thermal management, optical coupling, electrical connectivity, and mechanical stability.
• Work with materials such as silicon photonics, III-V semiconductors, and fiber-optic components in packaging designs.

Prototyping & Fabrication:

• Collaborate with external suppliers and internal teams to build prototypes and transition from concept to full-scale production.
• Ensure design-for-manufacturability (DFM) principles are applied to the photonic packages to ensure scalability and cost-effectiveness.

Thermal & Mechanical Analysis:

• Perform thermal and stress analysis of photonic packages to ensure proper heat dissipation and mechanical stability under varying environmental conditions.
• Use simulation tools to validate the design and ensure performance under thermal cycling, vibration, and mechanical stress.

Optical Alignment & Integration:

• Design package structures that optimize optical alignment between the PICs, optical fibers, optical components and external devices such as lasers and detectors.
• Develop high-precision alignment and assembly techniques to minimize optical losses and enhance signal integrity.

Collaboration:

• Work within a dedicated team of scientists and development engineers to drive the development of photonic technologies with respect to a wide range of applications.
• Work closely with photonic designers, engineers, process engineers, and manufacturing teams to refine packaging solutions.
• Support cross-functional teams in product development, providing input on package constraints and opportunities.

Testing and Validation:

• Define test protocols to validate the performance and reliability of the packaging solutions.
• Analyze data from thermal, mechanical, and optical tests to improve packaging designs and ensure product reliability.

Your Profile

• Master's degree or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• Specialized knowledge or coursework in photonics, optoelectronics packaging, or microsystems.
• 3+ years of industry or academic experience in the design and development of packaging solutions, preferably for photonics, optoelectronics, or semiconductor devices.
• Experience with packaging techniques such as wire bonding, flip-chip bonding, and fiber-optic alignment is highly desirable.
• Experience working with optical beam assemblies is a plus.
• Experience working with high-frequency electrical packaging and RF interconnects is a plus.
• Proficiency with CAD tools for 3D modeling and simulation (e.g., SolidWorks, AutoCAD, or ANSYS).
• Experience with thermal and stress simulation tools such as COMSOL or FEA software.
• Understanding of materials used in photonics packaging, including ceramics, polymers, metals, and adhesives.
• Familiarity with cleanroom and assembly techniques for photonic and electronic components.
• Strong analytical and problem-solving skills, with attention to detail in complex systems.
• Excellent communication and collaboration abilities, with a proactive approach to teamwork in English and German
• Ability to work in a fast-paced, deadline-driven environment.

Your ZEISS Recruiting Team:
Katharina Dandorfer